• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A gimped wire (11) includes a main core (12) and a primary cover wire (13a) wound in turns around the main core (12). The primary cover wire (13a) comprises at least one conductive wire element electrically connected to at least one electronic chip.
    公开号:FR3078980A1
    申请号:FR1852206
    申请日:2018-03-14
    公开日:2019-09-20
    发明作者:Daniele Sette；Nicolas Carteaux；Christopher Mackanic；Bernard Bancal
    申请人:Primo1d；
    IPC主号:
    专利说明:

    GUIPED THREAD COMPOSED OF A MAIN CORE AND AT LEAST ONE COVERED THREAD AND COMPRISING AT LEAST ONE ELEMENT
    CONDUCTIVE WIRE ELECTRICALLY CONNECTED TO AT LEAST ONE ELECTRONIC CHIP
    FIELD OF THE INVENTION
    The present invention relates to a textile yarn incorporating at least one electronic chip. Such threads can find their applications in the field of
    Electronic labeling
    RFID of objects (for "RadioFrequency
    IDentification ”according to the acronym dedicated), in particular of textile products. In this application, the electronic chip has radiofrequency emission reception functions and is associated with an antenna which can be in wired form in order to be easily integrated into the textile yarn.
    These transmission reception functions can be compatible with different standards, for example for near-field or far-field interrogation. The electronic chip can also have measurement functions and constitute a communicating sensor.
    The form factor and the flexible nature of such wires are very advantageous and allow them to be integrated into a wide variety of objects, for their identification, monitoring, administration or monitoring of their environments.
    TECHNOLOGICAL BACKGROUND OF THE INVENTION
    Documents WO2016038342, WO2011161336, GB2472025, GB2472026, or W02008080245 of such wires are known. They can comprise at least one wire forming a core, and a wire element or a plurality of wire elements electrically conductive (s) to which is assembled an electronic chip or a plurality of such chips. The core and the conductive wire element provided with electronic chips are arranged collinearly with respect to each other. At least one covering textile thread is wound in turns around the assembly formed by the core and the conductive wire element according to a well-known guipaqe technique.
    As a reminder, and according to this technique, the core wire is pulled through a hollow rotating coil carrying the cover wire. The core wire passes through the hollow coil in a vertical direction by pulling it up or down. The covering wire is unwound from the hollow coil and is wound helically around the core to form turns. It is common to wind a plurality of cover wires around the core, for example by placing the two hollow coils one above the other and by circulating the core through each of the coils rotated in the same direction or in an opposite direction.
    Whatever the method used to form the wrapped yarn, the core yarn is then provided with a spiral winding of at least one covering yarn. When a conductive wire element provided with electronic chips has been collinearly joined to the core wire (or when the core wire itself carries these chips), the covering wire encapsulates the electronic chips and protects them.
    The core and the conductive wire element are thus securely assembled together.
    In certain applications, it is advantageous to choose a core thread which has an extensible character. By “extensible yarn”, is meant a yarn having a high elastic elongation and elastic return power, typically greater than 50% or 100% of its length at rest. It may be a natural or synthetic rubber thread such as a polyurethane or spandex thread. The conductive wire element to which the electronic chips are connected is generally not extensible. It is often a metallic wire whose elongation power is less than 1%.
    Whether the core has elasticity properties or not, a wrapped yarn is liable to undergo, after its manufacture, longitudinal tensile forces which may be significant. When these forces are applied, there is a risk of breaking the conductive wire element collinear with the core or of separating the electronic chips from this wire element. In this case, the expected functions of the wire (electronic labeling, measurement, etc.) can no longer be used.
    OBJECT OF THE INVENTION
    The present invention therefore aims to at least partially solve this problem.
    BRIEF DESCRIPTION OF THE INVENTION
    With a view to achieving one of these aims, the object of the invention provides a covered wire comprising a main core and a primary covering wire wound in turns around the main core. According to the invention, the primary covering wire comprises at least one conductive wire element electrically connected to at least one electronic chip.
    By covering the conductive wire element in this way, connected to the electronic chip, to wind it in a turn around the main core, the longitudinal tensile forces which apply to this wire element are limited when the core undergoes deformation according to its length and which would be likely to put the conducting wire element in tension or to break it.
    According to other advantageous and non-limiting characteristics of the invention, taken alone or in any technically feasible combination:
    the primary covering wire comprises a secondary core, the conductive wire element being arranged collinearly with the secondary core, a secondary cover wire being wound in turns around the secondary core, of the conductive wire element and of the chip;
    - The conductive wire element has a non-uniform stiffness over its length, and the secondary core has a rigidity greater than the maximum rigidity of the conductive wire element;
    - The primary cover wire comprises a plurality of electronic chips assembled with the conductive wire element to form a chain of chips;
    - the chip chain is encapsulated in a protective material;
    the conductive wire element and the chip are carried by a segment of a carrier core, a carrier cover wire being wound in turns around the conductive wire element, the chip and the carrier core segment to form a segmented wired device;
    - The wire element is arranged colinearly to the carrier core segment;
    - The wire element is wound in a turn around the carrier core segment;
    - The wrapped yarn comprises a plurality of segmented wired devices arranged along the secondary core in the winding of the secondary covering wire;
    - The primary covering wire comprises two conductive wire elements, the electronic chip or the plurality of electronic chips being assembled to each of the conductive wire elements;
    the electronic chip or the plurality of electronic chips comprises a radiofrequency transmission-reception circuit;
    - The wrapped yarn comprises a plurality of primary covering yarns, at least one of these yarns being a textile covering yarn wound in turns around the main core;
    - the textile covering yarn covers the primary covering yarn;
    - A plurality of secondary cover son is wound in turns around the secondary core and the conductive wire element;
    BRIEF DESCRIPTION OF THE DRAWINGS
    Other characteristics and advantages of the invention will emerge from the detailed description of the invention which will follow with reference to the appended figures in which:
    FIG. 1 represents a chain of electronic chips;
    FIGS. 2a to 2c respectively represent a wired device of a first type, a chain of such devices and a section of such a device;
    Figures 3a to 3c respectively represent a wired device of a second type, a section
    of such device and a chain ofthese devices r Figure 4 represented a wire covered at a first mode of realization of the invention; Figure 5 represented a wire covered at a second embodiment of the invention;
    FIGS. 6a to 6d represent the steps for manufacturing a wrapped yarn according to a third embodiment of the invention.
    DETAILED DESCRIPTION OF THE INVENTION
    For the sake of simplification of the description to come, the same references are used for identical elements or ensuring the same function in the various embodiments described of the invention.
    With reference to FIG. 1, the present invention provides for the preparation of a chain 1 of electronic chips 2 (more simply designated “chips” in the remainder of this description), that is to say a plurality of linked chips 2 between them by at least one conductive wire element 3.
    By "chip" is meant any integrated electronic component implementing one or more functions. A chip can thus form a sensor, a transmission-reception device, have a data or memory processing capacity. The conductive wire element 3 is electrically connected to the chips 2 and can help to implement their functions. It can in particular make it possible to supply each chip and / or form an antenna when the chips 2 have transmission reception functions. The invention is not limited to a particular chip, or implementing a particular function. Similarly, the chain 1 can include any number of wire elements connecting the chips 2 to each other. All the chips 2 of a chain 1 are not necessarily all identical to each other in the chain
    1. For example, a first chip incorporating a transmission reception function may be disposed contiguously in the chain with a second chip incorporating a sensor function. In this configuration, at least one wired element connecting the first and the second chip can be used to transfer information between the two chips, for example a measurement established by the second chip so that it is transmitted by the first chip to a remote terminal .
    The chip chain 1 can be exploited as such. Alternatively, it can sometimes be useful to use only one segment of the chain 1 carrying a limited number of devices. For example when the chain 1 is made up of 2 RFID chips linked together by two wire elements, it is possible to take segments of this chain so that the portions of the wire elements of each segment have an arrangement and a length adapted to form the antenna of the RFID 2 chip to which they are electrically connected. Having the chips 2 in a chain 1, however, facilitates the handling of these chips, and the integration of segments into different types of objects, as was presented in the introduction to this application.
    This integration of segments into different types of object can advantageously be carried out after the chain of chips 2 has been packaged in the form of a textile thread, as is the case in the context of the present application. Each segment can then include a chip 2 or a plurality of chips 2 and one or more
    sections items wired 3 (forming themselves of the items wired) related to fleas, component a device segmented wireframe. The present invention not' 'is not limited to a
    particular technology for the preparation of the chain of chips 1 and any assembly process making it possible to provide a chain of chips 1 may be suitable. Preferably, however, the chain of chips 1 is obtained by means of the E-Thread ™ technology, a detailed description of which can be found in the documents US8471713, US8093617, US8723312, US2015318409, US8782880,
    US8814054 or US2015230336.
    According to this approach, represented in FIGS. 2a to 2c and 3a to 3c, the chips 2 are provided with at least one longitudinal groove 5a, 5b. The groove 5a, 5b may include a connection pad 4a, 4b connected to an input and / or an output of a functional circuit 4 of the chip 2. The groove 5a, 5b is provided for housing a portion of the wire element conductor 3a, 3b and thus assemble the chip 2 to this wire element 3a, 3b. When a wire element 3a, 3b is correctly housed in the groove 5a, 5b, it is brought into electrical contact with the connection pad 4a, 4b. The wire element 3a, 3b can be held in the groove 5a, 5b by simple embedding, by means of an adhesive, or retained by welding, by soldering or by any other means.
    The insertion of the conductive wire element 3a, 3b into the longitudinal groove 5a, 5b of the chips 2 can be automated, for example using insertion equipment such as that described in document US8782880 or in the request FR1750728 dated 01/30/2017. At the end of its manufacture, the chain of chips 1 can be wound on a support, such as a coil, for storage, transport and subsequent use.
    As noted previously, the invention is however in no way limited to the preparation of a chain of chips 1 by inserting a conductive wire element 3 into grooves carried by the chips 2. One could for example use a technology according to which the wire element 3 (or a plurality of such elements) is electrically connected to a connection pad formed on the surface of the chip 2. The implementation of such an approach is notably described in the document W02013114009 or the request FR1753404 of 17/04/2017.
    The present invention is of particular interest when the chips 2 of a chain 1, or at least a part of them, have radio frequency transmission-reception functions. Such a chip 2 combined with two sections of conductive wire elements 3a, 3b can form a radio frequency transmission-reception device. A more detailed description of the production of such a chain of transceiver chips 1, and of transceiver devices originating from this chain, will be found in document US8471773 and in application FR1750728 of 01/30/2017, already cited.
    This last document describes in particular a method making it possible to produce two different types of transceiver devices. In the first type of device, two portions of conductive wire elements 3a, 3b inserted into two longitudinal grooves 5a, 5b of a chip 2 comprising a transmit-receive circuit 4 each extend on one side and from the other of the chip 2 to form a dipole antenna, as shown in Figure 2a. The conductive portions 3a, 3b are connected to the transceiver circuit 4 by means of connection terminals 4a, 4b disposed in the grooves 5a, 5b in which these conductive portions 3a, 3b are housed. The electrical connection can be promoted by means of a solder or a solder 9. A wired transmission-reception device is obtained by taking a segment 6 of a chain 1 shown in FIG. 2b. To make the assembly robust, provision may be made to provide an adhesive 8 in the grooves and on the longitudinal sections of the conductive wire elements exposed in these grooves 5a, 5b. Provision may also be made to encapsulate the chip 2 with a protective material 7, such as a resin, making it possible to protect this chip 2 mechanically and chemically. By way of illustration, FIG. 2c presents a section of a transmission-reception device of the first type.
    The second type of transmission-reception device comprises an antenna having a closed loop. This loop is obtained by connecting to each other a portion of the conductive wire elements 3a, 3b, as shown in Figure 3a. These portions of wire elements are also connected to the transmission-reception circuit 4 by means of connection pads 4a, 4b as in the case of the first type of device. to insulate wired to coat, it is also necessary portions of elements is chip 2 resin.
    thus insulating portions 7 as provided that the one
    In this configuration electrically the two
    3a, 3b forming the loop, at least partially these of an electrically material: respectively represent a device for transmitting devices.
    3c a segment of its transmission-reception sample.
    wired elements 3a, 3b of transmission-reception 4 of the chip 2, of electrically disconnecting a portion of wired 3b, at the level of a cutout 10.
    section and a
    Figures 3b, 3c of the second type of chain of such shown on the component, after wired device formed in the circuit
    There is also the reception chain 1 chain 1, a For the antenna to be well adapted we have provided the element
    The present invention exploits the chip chain 1 which has just been presented to form a wrapped wire 11. Advantageously, the chip chain 1 is available in the form of a coil in order to be able to be easily integrated into wrapping equipment. , for example similar to that briefly presented introduction to the application.
    The chain of chips 1 can consist of a plurality of transceiver devices according to one or other of the two types which have been presented, but this choice does not in any way form a limitation of the invention.
    A wrapped wire according to the invention is of particular interest when the main core 12 of the wrapped wire 11 has a greater extensibility than that of the conductive wire element 3 of the chain of chips 1, but without this forming a essential characteristic of the invention.
    First mode of implementation
    FIG. 4 schematically represents a wrapped wire 11 in accordance with a first embodiment of the invention. This wire 11 comprises a main core 12, which can be an extensible wire (for example made of natural or synthetic rubber such as a polyurethane or elastane wire) or non-extensible. It may be a metallic thread or a textile thread, or more generally a single-strand or multi-strand polymeric thread. As with any wrapped wire, the wire 11 of this first embodiment comprises at least one covering wire 13 wound in turns around the main core 12, here two covering wires 13a, 13b.
    According to this first embodiment, at least one covering wire, designated “primary covering wire” 13a, consists of a chain of chips 1. In the case of the wrapped wire 11 shown in FIG. 4 which comprises two cover yarns, the second cover yarn 13b can be a textile yarn. Advantageously, when the wrapped thread 11 comprises several covering threads, the turns of one of these threads are arranged to cover the turns of the chain 1 with chips 2 forming the primary covering thread
    13a. The second covering wire 13b thus makes it possible to hold the chain 1 firmly against the main core 12. It is possible to provide more than one second covering wire, so as to promote the maintenance of the chain 1 against the main core 12, or even fully encapsulate it. Advantageously, the cover wires 13a, 13b are wound on the core in opposite winding directions, so as to balance the stresses, in particular of torsion, that they can generate in the wire 11.
    Provision may be made to treat the chain of chips 1 to encapsulate it with a protective material. It may be to extrude a material, for example plastic, on the chain 1, and more particularly on the wire element.
    3. In this way it avoids putting in electrical contact two turns of the wire element 3, when the chip chain is wound in a turn around the main core 12. And it is protected mechanically and chemically from its environment. To facilitate the application of the protective material, one can arrange the chain 1 on a retaining wire and affix the protective material so that it encapsulates the chain 1 and this retaining wire.
    As an alternative, or in addition, provision may also be made to treat the wrapped yarn 11 itself in order to coat it with this protective material, using the same techniques, for example of extrusion.
    It will be noted that in the configuration of this first embodiment, the wrapped wire 11 can undergo traction or bending forces which are exerted on the main core 12 and which are liable to deform it elastically along its length. The chain 1 being arranged in a spiral around the main core 12, the deformation of the main core 12 does not transfer the tensile or bending forces longitudinally on the wire element 3. This thus avoids breaking this element, or to disassemble the chips 2 from this wire element, and to make the functions of a chip 2 inoperative. This thus provides a wrapped wire 11 which can undergo longitudinal or bending stresses while remaining functional, even when the main core 12 is expandable.
    When the chip chain 1 consists of a plurality of transceiver devices whose antennas consist of at least one conductive wire element 3a, 3b, it is important that the “spiraled” antenna extends over a effective length of main core wire 12 large enough to be functional. When the distance between two contiguous chips 2 of the chain 1 is fixed, this effective antenna length is determined by the diameter of the main core 12 (which fixes the length of a turn) and by the pitch between two turns ( which is fixed by the relative speeds of travel of the main core 12 and of rotation of the coil carrying the chain of chips 1 during the covering operation). We can therefore play on one and the other of these parameters to form a wrapped wire 11 comprising transmission-reception devices which can be functional.
    It is also noted that the frequency response of the transmitting reception devices carried by the wrapped wire 11 is dependent on this effective length of antenna.
    There was presented in the introduction to the application a wrapping process which can be perfectly used to make a wrapped wire 11 according to this first embodiment. It is thus possible to axially scroll the main core wire 12 through a hollow coil carrying the chain of chips 1. This coil is unwound to wind the chain of chips 1 helically around the main core wire 12 so as to constitute the turns. A second spool can carry the textile thread forming the second covering thread 13b, which is wound on the main core 12 in a similar manner.
    One can provide several coils, cover son to wind any number of around the main core 12. But the invention is in no way limited to such a manufacturing process and any other method for winding a wire in turns coverage around a soul may be suitable.
    The yarn 11 fabricated in this way is wound on a final spool. We can take segments 6 of this wire 11, as shown for a chip chain 1, to form functional wired devices and allow their integration into different types of objects, such as clothing.
    Second embodiment
    FIG. 5 represents a wrapped yarn 11 according to a second embodiment of the invention. The covered wire 11 has a main core 12 similar to the main core of the first embodiment, and a primary covering wire 13a comprising a chain of chips 1. However, in this second embodiment, the covering wire primary 13a is itself a wrapped wire. As is more visible on the insert of FIG. 5, the primary covering wire 13a is formed of a chain of chips 1 associated collinearly with a secondary core 14, the chain 1 and the secondary core 14 being covered by at minus a secondary cover wire 15 wound in a spiral.
    To produce a wire 11 in accordance with this second embodiment, the chain of chips 1 can be passed successively twice through a covering equipment.
    During the first covering step, the secondary core 15 and the chain of chips 1 are collinearly aligned with each other, for example by unwinding them from their respective coils and by circulating them jointly through the opening of a hollow coil carrying the secondary covering thread 15. This secondary covering thread 15 may be a textile thread. Conventionally, the secondary covering wire 15 is wound in turns around the secondary core 14 and the chain of chips 1. The covered wire 13a obtained from this first covering step is recovered in a coil.
    During a second covering step, the coil thus obtained is used as the primary covering wire 13a of the main core 11 and the same operation is carried out as that described in the first embodiment of the invention to obtain the wrapped yarn 11 shown in FIG. 5. In the first and second wrapping steps, it is possible to wind several covering threads in turns.
    This second embodiment of the invention is advantageous in that it makes it possible to properly protect the chain of chips 1 using the secondary covering wire 15. The wire obtained at the end of the first covering step s '' easily integrates as primary cover wire 13 in the covering equipment, which is not always the case with a chain of chips 1, in particular when the latter comprises a plurality of wire elements 3 connecting the chips 2 between them.
    In this embodiment, provision may also be made to encapsulate the chain of chips 1 with a protective material, for example by extruding this protective material.
    14, before secondary
    Insulating coating when the chain rests on the secondary core or
    15.
    one after the application of the wire since it could sometimes be advantageous covering section of the wire elements 3 of a resin to prevent them from contacting each other electrically. This section will form a homogeneous chip chain along its length.
    can affect the winding on the main core 12 covering, and
    1'enroulement.
    choose 'core stiffness rigid coated cover whose resin leads to stiffness is not
    This variability in spiral stiffness of the upper chip chain from from one to one during the second stage, in particular the regularity of the steps To prevent this, a secondary material may be provided with the rigidity of the most sections of the chain 1 In this way, in the primary wire 13a, the variations in rigidity are masked, which facilitates its winding in turns during the second step, the nature of which it has a rigidity made up of the chain core 1, the core can be chosen. main 11 at the covering. Alternatively, insulating resin 7 less than or equal to secondary 14, to specify that by rigidity there is resistance for the material of which it is safe to lead to bending of to an identical result. The chip chain 1 is more particularly designated.
    In a very general way, and whatever the constitution of the chain of chips 1, when the wire element 3 which composes it or a segment 6 of this wire element 3, has an inhomogeneous rigidity over its length, we will choose preferably the secondary core 14 so that it has a rigidity greater than the maximum rigidity of the wire element 3.
    Third embodiment
    In general, the distance separating two chips 2 on the chain 1 is fixed during the production of the chain 1. When the chain 1 is wound around the main core 12, in accordance with one of the modes of embodiment described, the effective distance (along the core) separating two contiguous chips 2 from the chain 1, is fixed by the diameter of the main core 12 and by the pitch separating two turns. The third embodiment of a wrapped wire 11 according to the invention aims to give more freedom of choice in the effective distance separating two chips 2 along the wrapped wire 11. The steps of this third mode are shown in the figures 6a to 6d.
    In a first step shown in FIG. 6a, the first covering step of the second embodiment is reproduced to obtain a covered covering wire 17, composed of a carrying core 16, of a chain 1 of chips arranged collinearly with the carrier core 16, and a carrier cover wire 18 wound in turns around the carrier core 16 and the chain 1.
    In a second step, represented in FIG. 6b, this gimped carrying wire 17 is cut into a segment 6 so as to define a plurality of segmented wired devices 6. By way of example, the chain of chips 1 can consist of chips d 'transmission-reception aimed at forming transmission-reception devices of the first or second type as has been presented previously in connection with the description of Figures 2a to 3c. In this case, the step of cutting into segments 6 of the gimped carrying wire 16 aims to separate from the chain 1 functional wired devices 6, which will be designated in the following description by the expression “segmented wired devices”. At the end of this second step, there is therefore a plurality of segmented wired devices 6 each formed of a segment of the carrier core 16 carrying at least one conductive wired element 3 electrically connected to at least one chip 2, and a carrier cover wire 18 wound in a turn around the core segment 16, the wire element 3 and the chip 2.
    In a following step shown in FIG. 6c, and during a second covering step, a secondary covering wire 15 is wound in turns around a secondary core 14 to form a covered wire 13a. At instants chosen during the scrolling of the secondary core 14 and the winding of the secondary covering wire 15, the segmented wired devices 6 obtained at 1 are introduced one by one, by means of the covering equipment. 'from the previous step to place them between the secondary core 14 and the secondary covering wire 15.
    In this way it is possible to form a wrapped wire 13a comprising a plurality of segmented wired devices 6 arranged collinearly with the secondary core 14, the distance separating two devices 6 being perfectly controlled, and independent of the parameters of the chain of chips 1.
    This wrapped yarn 13a can be collected on a spool and used as the primary covering yarn 13a of a wrapped yarn 11 comprising the main core 12, during a third wrapping step in accordance with what has been presented in connection with the first and second embodiments of the invention. This step is shown in Figure 6d.
    At the end of this last step, there is a wrapped wire 11 comprising a main core 12 and at least one covering wire 13a wound in turns around the main core. The covering wire 13a comprises a secondary core 14 and a secondary covering wire 15 wound in a turn around the secondary core 14. Segmented wired devices 6 are distributed along the primary covering wire 13a, collinear with the secondary core 14 and held against this core 14 by the turns of the secondary covering wire 15. Each segmented wired device 6 comprises at least one conductive wired element 3, and at least one chip 2 electrically connected to this wired element 3, carried by a segment d carrier core 16 and held against this core 16 by a carrier cover wire 18 wound in turns around the core 16, the wire element 3 and the chip 2.
    In a variant of this third embodiment, it is possible to choose, during the first covering step, to wind the chip chain 1 in turns around the carrier core 16, rather than placing it collinearly with this core. This makes it possible to give a spiral shape to the wire element 3, the diameter of the turns being then imposed by the diameter of the carrying core 16.
    In this third embodiment, it may be advantageous to choose the material of the secondary core 14 so that it is electrically conductive. The secondary core 14 can be electrically coupled to the wire element 3 when the latter forms an antenna of a transceiver device in order to adapt the impedance thereof or, more generally, to improve performance.
    Application examples
    A wrapped yarn 11 according to the invention can find applications in numerous fields, for example by directly integrating this yarn into the manufacture of objects, or even by integrating sections taken from this yarn in these objects.
    In the field of ropes of any kind (metallic textile, etc.), provision may be made to use the wrapped wire 11 braided in the rope or disposed in any way therein. When the wrapped wire 11 incorporates chips 2 having RFID transmission-reception functions, we can then exploit the properties of this wire 11 to provide the stringing with numerous functions which go far beyond the simple identification or location of this string.
    Thus, one can count, by radio frequency interrogation, the number of transmit-receive chips 2 included in the string, in order to determine its length.
    By measuring the phase shift of the retro radio frequency signal propagated by the RFID 2 chips, it is possible to very precisely determine the distance separating two chips 2 along this cord. We can therefore monitor, when the rope is operated in tension, the deformations it undergoes to inform excessive deformations which would lead for example to its plastic deformation, and which could make it susceptible to break.
    When the conductive wire element 3 forming the antenna of a RFID wire device is spiraled, the antenna may be dependent on the main core, for example the first of which is the case of a wire effective length degree of extension device rests, covered 11 according to the invention. The frequency and / or interrogation of the radiofrequency be affected also this deformation, embodiment of the device by this degree of extension. We phenomenon for in its signal strength
    RFID can therefore use the measurement to establish a length, can form the rope.
    The wrapped object wire having a longitudinal direction: can thus have disposed along the protective sheath of the also extending cable, such a wire in conductive wires to be integrated into everything mainly according to conduit, pipes ... There is an electric cable, or integrated in cable.
    As such, it is possible to provide for wrapped wire 11 to be made up of these of the electric cable the main core 12 elongated form that RFID functionalities. Depending on the main core conductor or itself. In a more general way, can be constituted by any object one wishes to present presents proposes comprising a body of longitudinal shape, 13a wound according to that of one of to equip it, for example, another aspect therefore, to realize an elongated device according a direction and comprising a primary cover wire in turn direction minus one electrically comprises at least one chip around the body of longitudinal elongated shape. The primary wire 13a connected wire element 3
    Portions of the same wrapped wire can also find or this wrapped wire their applications luipour integrate into any deformable object with which one wishes to integrate advanced functions such as measurement functions and / or transmission reception functions. The resilience to deformation of a wire according to the invention, in particular when it is subjected to bending and / or tensile forces, makes it particularly suitable for these applications. It may for example involve integrating a portion of the wrapped wire 11 directly into the material of rubber-based objects, such as tires or seals, or based on plastic, elastomer or composite materials. Based on the same principles as those already exposed, the wire portions can for example be used to measure and transmit the fatigue state of these materials. It is also possible to envisage integrating measurement functionalities into the circuits 4 of at least some of the chips 2, in order to be able to determine and transmit richer information on the material of the object or on its environment.
    The primary core wire 12 can be chosen as an extensible textile yarn, and the wrapped yarn 11 can then be directly integrated in the form of a yarn or portion of this yarn into extensible fabrics, such as fabrics for medical use or technical.
    Of course, the invention is not limited to the modes of implementation described and it is possible to add variants without departing from the scope of the invention as defined by the claims.
    权利要求:
    Claims (9)
    [1" id="c-fr-0001]
    1. Text.il thread · wrapped (11) comprising a main core (12) and at least one primary covering wire (13a, 13b) wound in turns around the main core (12), the wrapped wire (11) being characterized in that the wire primary cover (13a) comprises two wired conductive elements (3 .. · 3tx and at least one pus éi e and rom. that (2), - the wired conductive elements ia, 3b) being respectively arranged within grooves idugitudinal eta, 5m) dm the microchip (2) esa modem -— ai —e-sbmsm-t — é-iémèeae — emmdmebeem — fé — y — 3-a -— been — same-a
    S'OmemS'ùvitT '-' dOieCl'S— · “····· ΟΟ — ΟηΌίνννδ · —USva · —pe-S-S · —0 · 0 · & Ο · 000 00ΓνΌ ..... fd ' · ·
    [2" id="c-fr-0002]
    2. Covered textile thread (11) according to the preceding claim, in which the primary covering thread (13a) comprises a secondary core (14), the conductive wire element (3) being arranged collinearly with the secondary core (14), a secondary cover wire (15) being wound in turns around the secondary core (14), the conductive wire element (3; 3a, 3b) and the chip (2).
    [3" id="c-fr-0003]
    3. Covered textile yarn (11) according to one of the preceding claims, in which the conductive wire element (3, 3a, 3b) has a non-uniform stiffness over its length, and the secondary core (14) has a stiffness greater than the maximum rigidity of the conductive wire element (3, 3a, 3b).
    [4" id="c-fr-0004]
    4. Covered textile yarn (11) according to one of the preceding claims, in which the primary covering yarn (13a) comprises a plurality of electronic chips (2) assembled with the conductive wire element (3; 3a, 3b) to form a chain of chips (1).
    [5" id="c-fr-0005]
    5. υχίι1 & gimped wire (11) according to the preceding claim, the chip chain (1) being encapsulated in a protective material.
    [6" id="c-fr-0006]
    6. Covered textile yarn (11) according to one of claims 2 and 3 in which the conductive wire element (3; 3a,
    3b) and the chip (2) are carried by a segment of a supporting core (16), a supporting covering wire (18) being wound in turns around the conductive wire element (3; 3a, 3b), the chip (2) and the carrier core segment (16) to form a segmented wired device (6).
    [7" id="c-fr-0007]
    7. Covered textile yarn (11) according to the preceding claim, in which the wired element (3) is disposed co-linearly with the carrying core segment (16).
    [8" id="c-fr-0008]
    8. Gimped textile yarn (11) according to claim 6, in which the wired element (3) is wound in a turn around the carrying core segment (16).
    [9" id="c-fr-0009]
    9. gimped wire (11) according to one of claims 6 to 8, comprising a plurality of segmented wire devices arranged along the secondary core (14) in the winding of the secondary cover wire (15) rlCL______________ Covered textile yarn (11) according to the preceding claim, in which the electronic chip (2) or the plurality of electronic chips (2) comprises a radiofrequency transmission-reception circuit (4).
    ·, ·· 11 .______________ Covered textile thread (11) according to one of the preceding claims comprising a plurality of primary covering threads (13a, 13b), at least one of these threads being a textile covering thread (13b) wound in turns around the main core (12).
    rd2; .............. Covered textile thread (11) according to the preceding claim, in which the textile covering thread (13b) covers the primary covering thread (13a).
    -1,3, ............... Covered textile yarn (11) according to one of claims 2 to 9 in which a plurality of secondary covering yarns (15) is wound in turns around the secondary core (14) and the conductive wire element (3; 3a, 3b).
    1/5
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    引用文献:
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    法律状态:
    2019-03-27| PLFP| Fee payment|Year of fee payment: 2 |
    2019-09-20| PLSC| Publication of the preliminary search report|Effective date: 20190920 |
    2020-03-19| PLFP| Fee payment|Year of fee payment: 3 |
    2021-03-18| PLFP| Fee payment|Year of fee payment: 4 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1852206A|FR3078980B1|2018-03-14|2018-03-14|GUIPED WIRE CONSISTING OF A MAIN CORE AND AT LEAST ONE COVERING WIRE AND INCLUDING AT LEAST ONE CONDUCTIVE WIRED ELEMENT ELECTRICALLY CONNECTED TO AT LEAST ONE ELECTRONIC CHIP|
    FR1852206|2018-03-14|FR1852206A| FR3078980B1|2018-03-14|2018-03-14|GUIPED WIRE CONSISTING OF A MAIN CORE AND AT LEAST ONE COVERING WIRE AND INCLUDING AT LEAST ONE CONDUCTIVE WIRED ELEMENT ELECTRICALLY CONNECTED TO AT LEAST ONE ELECTRONIC CHIP|
    PCT/FR2019/050564| WO2019175509A1|2018-03-14|2019-03-14|Covered wire comprising a main core and at least one covering wire and comprising at least one conductive wire element electrically connected to at least one electronic chip|
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